Automotive System
CHALLENGES
- Sophisticated system consisting of multiple processors designed for autonomous automotive applications.
- The availability of components has been affected due to the Covid pandemic
- The system incorporates densely packed designs utilizing 18-layer and 8-layer printed circuit boards (PCBs).
- The PCBs are designed to accommodate a high number of components within a limited space.
- The system requires analysis and optimization of signal integrity, power integrity, and system-level thermal considerations.
- Ensuring proper signal transmission, power delivery, and managing thermal effects in the system.
- The system is designed to meet specific requirements for automotive applications.
- Compliance with automotive industry standards and regulations.
SOLUTIONS
- A subsystem dedicated to processing and managing data streaming and control operations.
- Capable of accommodating multiple GMSL2 camera interfaces for video input.
- Incorporated multicore MCU that serves as a safety processor and facilitates communication with the vehicle.
- Features a multiport Ethernet Switch that supports multiple interfaces such as PCIe, SGMII, RGMII, XFI, and JTAG.
- Includes the integration of multiple 4G/5G modems to establish remote connections.
- Supports a variety of interfaces such as BT1, RJ45, CAN, Camera, 4G/5G Antenna, USB, I2C, SPI, and JTAG.
- The MCU incorporates various features such as voltage monitoring, RTC (Real-Time Clock), Wake on CAN, Boot on CAN, and USB functionality.
BENEFITS
- Accelerated time-to-market: Proof-of-Concept (POC) achieved within 9 months despite the challenges posed by the COVID-19 pandemic.
- The solution is supplied in a shorter timeframe compared to larger OEMs.
- Reduced lead time in delivering the solution.
- The POCs provided are well-suited for vehicle trial runs.
- Capable of being tested and evaluated in real-world automotive scenarios.
- Took responsibility of various stages, including prototype and pilot production, system integration, and testing.
