Automotive System

CHALLENGES

  • Sophisticated system consisting of multiple processors designed for autonomous automotive applications.
  • The availability of components has been affected due to the Covid pandemic
  • The system incorporates densely packed designs utilizing 18-layer and 8-layer printed circuit boards (PCBs).
  • The PCBs are designed to accommodate a high number of components within a limited space.
  • The system requires analysis and optimization of signal integrity, power integrity, and system-level thermal considerations.
  • Ensuring proper signal transmission, power delivery, and managing thermal effects in the system.
  • The system is designed to meet specific requirements for automotive applications.
  • Compliance with automotive industry standards and regulations.

SOLUTIONS

  • A subsystem dedicated to processing and managing data streaming and control operations.
  • Capable of accommodating multiple GMSL2 camera interfaces for video input.
  • Incorporated multicore MCU that serves as a safety processor and facilitates communication with the vehicle.
  • Features a multiport Ethernet Switch that supports multiple interfaces such as PCIe, SGMII, RGMII, XFI, and JTAG.
  • Includes the integration of multiple 4G/5G modems to establish remote connections.
  • Supports a variety of interfaces such as BT1, RJ45, CAN, Camera, 4G/5G Antenna, USB, I2C, SPI, and JTAG.
  • The MCU incorporates various features such as voltage monitoring, RTC (Real-Time Clock), Wake on CAN, Boot on CAN, and USB functionality.

BENEFITS

  • Accelerated time-to-market: Proof-of-Concept (POC) achieved within 9 months despite the challenges posed by the COVID-19 pandemic.
  • The solution is supplied in a shorter timeframe compared to larger OEMs.
  • Reduced lead time in delivering the solution.
  • The POCs provided are well-suited for vehicle trial runs.
  • Capable of being tested and evaluated in real-world automotive scenarios.
  • Took responsibility of various stages, including prototype and pilot production, system integration, and testing.

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